Nio's chip subsidiary completes the signing of the first round of financing agreements exceeding 2.2 billion yuan

On February 26, Nio announced that its chip subsidiary, Anhui Shenji Technology Co., Ltd., completed the signing of the first round of equity financing agreements, with financing exceeding 2.2 billion yuan and a post-investment valuation nearing 10 billion yuan. This round of financing brought together several industry capital firms and leading institutions, including Hefei Guotou, Hefei Haiheng, IDG Capital, SMIC PolySource, and Oriza Holdings. The proceeds will support Shenji's continued R&D and promotion of high-end, highly competitive chip products, bolstering Nio’s long-term strategic plans in autonomous driving and embodied intelligence.

Anhui Shenji is the first company in the country to develop 5nm automotive-grade chips and achieve large-scale commercial application. The performance of the 'Shenji NX9031' chip, which offers the equivalent capability of four chips in one, has consistently ranked first among domestic automotive chips. Since beginning production in 2024, it has shipped over 150,000 units and been successfully deployed across all models of the Nio brand. Following this round of financing, Shenji plans to launch a high-performance chip for next-generation autonomous driving as well as multiple chips for other fields. While Shenji’s early orders mainly come from Nio, the company is also actively expanding into emerging sectors such as embodied robotics and Agent inference, providing complete chip and smart hardware solutions to various customers in the AGI era.

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