Huachen Xinguang completes new financing round exceeding RMB 100 million, accelerating domestic substitution of high-end optical chips

Zhejiang Huachen Xinguang Technology Co., Ltd. (hereinafter referred to as "Huachen Xinguang") is a high-tech enterprise engaged in the design and manufacturing of telecom-grade, highly reliable semiconductor laser chips and modules. According to news from Investment Circle on November 4, Huachen XinguangCompleted a new round of financing exceeding RMB 100 million,Jointly invested by Trinity Capital, Zhizao Anhe, and Jingshuihu Venture Capital.With this, Huachen Xinguang has successfully completed two rounds of financing in 2026, as capital continues to pour into the high-end optical chip sector.

Zhejiang Huachen Xinguang Technology Co., Ltd., established in September 2021, is a high-tech enterprise specializing in highly reliable semiconductor laser chips under an IDM (Integrated Device Manufacturer) model. It gathers top global talent in the fields of GaAs and InP compound semiconductors, with technical capabilities covering the entire value chain, including chip design, epitaxial growth, fab processes, device packaging and testing, and reliability testing.

From its inception, Huachen Xinguang chose the IDM model to build its own wafer fab, packaging and testing lines, and reliability verification systems. Its globally unique WXP high-reliability laser cavity facet passivation technology increases the catastrophic optical damage (COD) threshold by over 500%, extends chip lifespan to more than 200,000 hours, and improves yield by 35%. This supports its disruptive competitiveness: "performance benchmarking against US peers at half the cost."

Reportedly, the company operates a 5,000-square-meter full-process manufacturing fab for optical chips in Wuxi, as well as packaging and testing facilities and a high-speed data communication optical engine manufacturing base totaling over 10,000 square meters in Quzhou, Zhejiang, and Wuhan, Hubei. Its products are widely used in fiber optic communications, data communications, satellite communications, quantum computing, and other fields.

The funds from this round of financing will be primarily used to enhance reliability testing capabilities for mass-produced multi-series chips, expand production capacity, and develop next-generation products.

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