IPO News | "Intelligent Chip Provider" Ingenic Semiconductor launches IPO, plans to list on August 25, with a lot size subscription amount of HKD 10,383.68

Futu News, August 17 update:$INGENIC (03223.HK)$Announced that the IPO will take place from August 17 to August 20. The company plans a global offering of approximately 31.2873 million shares and is expected to list on August 25.

Company Overview

The company is a provider of "Memory + Computing + Analog" chips. Leveraging industry trends and proprietary technology, the company offers memory chips optimized for AI workloads, computing chips with acceleration and inference capabilities, and analog chips enabling intelligent sensing and power management. Its products are widely used in automotive electronics, industrial medical devices, AIoT, and smart security equipment.

The company operates under a fabless model, focusing on chip R&D and design while collaborating with leading foundries and assembly/test subcontractors to ensure business scalability. Through organic growth and strategic acquisitions, the company has built a comprehensive product portfolio. According to Frost & Sullivan, the company holds a leading position in key global markets, continuously empowering development and innovation in frontier tech sectors such as automotive electronics and edge AI.

Financial Overview

The company's total revenue decreased from RMB 4,530.9 million in 2023 to RMB 4,212.6 million in 2024, primarily due to a decline in sales revenue from memory chips. Total revenue subsequently increased to RMB 4,741.0 million in 2025, mainly driven by higher sales revenue from both memory and computing chips.

The company's gross profit decreased by 8.4% from RMB 1,608.0 million in 2023 to RMB 1,473.1 million in 2024, primarily due to the decline in revenue. Gross margin remained relatively stable at 35.5% in 2023 and 35.0% in 2024, before further declining to 32.8% in 2025.

Use of Proceeds

Regarding the use of proceeds, Ingenic Semiconductor expects net proceeds from the global offering to be approximately HK$3.141 billion (assuming the over-allotment option is not exercised, based on an offer price of HK$102.8). According to the prospectus, Ingenic Semiconductor intends to allocate the funds raised from the global offering for the following purposes:

Approximately 50.0% will be used to strengthen technological innovation and product development across the company's three core product lines (memory chips, computing chips, and analog chips); approximately 25.0% will be allocated for strategic investments or acquisitions to seize growth opportunities; approximately 15.0% will be used to expand the company's network and promote its products; and approximately 10.0% will be utilized for working capital and other general corporate purposes, including daily operations and general corporate expenses.

Further reading:Ingenic Semiconductor Prospectus

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Edited by Vincent

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